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A $63 billion structure will finance Broadcom chips for Anthropic

Bank of America, Blackstone, Citi and Morgan Stanley announced $63 billion in financing on 26 October 2026 for AI equipment intended for Anthropic. Initial deliveries are expected in 2027.

A special-purpose vehicle will buy Broadcom XPU accelerators and networking equipment and lease them to the Claude developer. The banks are arranging first-lien debt, while Blackstone supplies the committed second-lien portion.

Broadcom provides residual-value support equivalent to the first-lien financing. The transaction therefore funds future access to hardware; it is neither a completed delivery nor a $63 billion equity fundraising by Anthropic.

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